K. Weide-Zaage: search on Z-Library

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1

Three-Dimensional Voids Simulation in chip Metallization Structures: a Contribution to Reliability Evaluation

D. Dalleau, K. Weide-Zaage

Journal:

Microelectronics Reliability

Year:

2001

File:

PDF, 495 KB

2001

2

Simulation of time depending void formation in copper, aluminum and tungsten plugged via structures

David Dalleau, Kirsten Weide-Zaage, Yves Danto

Journal:

Microelectronics Reliability

Year:

2003

File:

PDF, 1.27 MB

2003

3

Simulation of packaging under harsh environment conditions (temperature, pressure, corrosion and radiation)

Weide-Zaage, Kirsten

Journal:

Microelectronics Reliability

Year:

2017

Language:

english

File:

PDF, 1.71 MB

english, 2017

4

Determination of migration effects in Cu-via structures with respect to process-induced stress

Weide-Zaage, Kirsten, Zhao, Jiani, Ciptokusumo, Joharsyah, Aubel, Oliver

Journal:

Microelectronics Reliability

Year:

2008

Language:

english

File:

PDF, 1.13 MB

english, 2008

5

Electro- and thermo-migration induced failure mechanisms in Package on Package

L. Meinshausen, K. Weide-Zaage, H. Frémont

Journal:

Microelectronics Reliability

Year:

2012

Language:

english

File:

PDF, 3.84 MB

english, 2012

6

Impact of aluminium addition on the corrosion behaviour of Sn–1.0Ag–0.5Cu lead-free solder

Nordin, N. I. M., Said, S. M., Ramli, R., Weide-Zaage, K., Sabri, M. F. M., Mamat, A., Ibrahim, N. N. S., Mainal, A., Datta, R. S.

Journal:

Year:

2015

Language:

english

File:

PDF, 2.84 MB

english, 2015

7

[IEEE 2017 18th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE) - Dresden, Germany (2017.4.3-2017.4.5)] 2017 18th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE) - Simulation investigations for the comparison of standard and highly robust AlCu thick metal tracks

Sethu, Raj Sekar, Hein, Verena, Erstling, Marco, Weide-Zaage, Kirsten

Year:

2017

Language:

english

File:

PDF, 26.70 MB

english, 2017

8

Dynamic simulation of migration induced failure mechanism in integrated circuit interconnects

Moujbani, Aymen, Kludt, Jörg, Weide-Zaage, Kirsten, Ackermann, Markus, Hein, Verena, Meinshausen, Lutz

Journal:

Microelectronics Reliability

Year:

2013

Language:

english

File:

PDF, 1.29 MB

english, 2013

9

Dynamic simulation of octahedron slotted metal structures

Kludt, J., Weide-Zaage, K., Ackermann, M., Hein, V.

Journal:

Microelectronics Reliability

Year:

2013

Language:

english

File:

PDF, 2.59 MB

english, 2013

10

Reliability of Wafer Level Chip Scale Packages

Rongen, R., Roucou, R., vd Wel, P.J., Voogt, F., Swartjes, F., Weide-Zaage, K.

Journal:

Microelectronics Reliability

Year:

2014

Language:

english

File:

PDF, 3.12 MB

english, 2014

11

Migration induced IMC formation in SAC305 solder joints on Cu, NiAu and NiP metal layers

L. Meinshausen, H. Frémont, K. Weide-Zaage

Journal:

Microelectronics Reliability

Year:

2012

Language:

english

File:

PDF, 554 KB

english, 2012

12

Simulation of the influence of TiAl3 layers on the thermal–electrical and mechanical behaviour of Al metallizations

J. Kludt, K. Weide-Zaage, M. Ackermann, V. Hein

Journal:

Microelectronics Reliability

Year:

2012

Language:

english

File:

PDF, 1.05 MB

english, 2012

13

Evaluation new corner stress relief structure layout for high robust metallization

Hein, V., Kludt, J., Weide-Zaage, K.

Journal:

Microelectronics Reliability

Year:

2014

Language:

english

File:

PDF, 2.33 MB

english, 2014

14

Effect of thermal aging on the electrical resistivity of Fe-added SAC105 solder alloys

Sabri, M.F.M., Nordin, N.I.M., Said, S.M., Amin, N.A.A.M., Arof, H., Jauhari, I., Ramli, R., Weide-Zaage, K.

Journal:

Microelectronics Reliability

Year:

2015

Language:

english

File:

PDF, 952 KB

english, 2015

15

Influence of air gaps on the thermal–electrical–mechanical behavior of a copper metallization

Irina Bauer, Kirsten Weide-Zaage, Lutz Meinshausen

Journal:

Microelectronics Reliability

Year:

2011

Language:

english

File:

PDF, 724 KB

english, 2011

16

Degradation behavior in upstream/downstream via test structures

Kludt, J., Weide-Zaage, K., Ackermann, M., Hein, V., Kovács, C.

Journal:

Microelectronics Reliability

Year:

2014

Language:

english

File:

PDF, 1.26 MB

english, 2014

17

[IEEE 2015 IEEE International Symposium on Electromagnetic Compatibility - EMC 2015 - Dresden, Germany (2015.8.16-2015.8.22)] 2015 IEEE International Symposium on Electromagnetic Compatibility (EMC) - How SI/EMC and reliability issues could interact together in embedded electronic systems?

Weide-Zaage, Kirsten, Moujbani, Aymen, Duchamp, Genevieve, Dubois, Tristan, Verdier, Frederic, Fremont, Helene

Year:

2015

Language:

english

File:

PDF, 1.21 MB

english, 2015

18

Electro- and thermomigration induced Cu3Sn and Cu6Sn5 formation in SnAg3.0Cu0.5 bumps

Meinshausen, L., Frémont, H., Weide-Zaage, K., Plano, Bernard

Journal:

Microelectronics Reliability

Year:

2015

Language:

english

File:

PDF, 1.01 MB

english, 2015

19

[IEEE 2008 IEEE International Reliability Physics Symposium (IRPS) - Phoenix, AZ, USA (2008.04.27-2008.05.1)] 2008 IEEE International Reliability Physics Symposium - Comprehensive reliability analysis of CoWP Metal Cap unit processes for high volume production in sub-μm dimensions

Aubel, O., Thierbach, S., Seidel, R., Freudenberg, B., Meyer, M.A., Feustel, F., Poppe, J., Nopper, M., Preusse, A., Zistl, C., Weide-Zaage, K.

Year:

2008

Language:

english

File:

PDF, 322 KB

english, 2008

20

Simulation and measurement of the flip chip solder bumps with a Cu-plated plastic core

Weide-Zaage, K., Schlobohm, J., Rongen, R.T.H., Voogt, F.C., Roucou, R.

Journal:

Microelectronics Reliability

Year:

2014

Language:

english

File:

PDF, 3.48 MB

english, 2014

21

Electro- and thermomigration-induced IMC formation in SnAg3.0Cu0.5 solder joints on nickel gold pads

Meinshausen, L., Frémont, H., Weide-Zaage, K., Plano, B.

Journal:

Microelectronics Reliability

Year:

2013

Language:

english

File:

PDF, 1.62 MB

english, 2013

22

Migration induced material transport in Cu–Sn IMC and SnAgCu microbumps

L. Meinshausen, K. Weide-Zaage, H. Frémont

Journal:

Microelectronics Reliability

Year:

2011

Language:

english

File:

PDF, 731 KB

english, 2011

23

[IEEE 2013 14th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE) - Wroclaw (2013.4.14-2013.4.17)] 2013 14th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE) - Influence of contact geometry variations on the lifetime distribution of IC packages during electromigration testing

Meinshausen, L., Weide-Zaage, K., Fremont, H.

Year:

2013

Language:

english

File:

PDF, 1.46 MB

english, 2013

24

Investigation of stress distribution in via bottom of Cu-via structures with different via form by means of submodeling

Johar Ciptokusumo, Kirsten Weide-Zaage, Oliver Aubel

Journal:

Microelectronics Reliability

Year:

2009

Language:

english

File:

PDF, 1.46 MB

english, 2009

25

Simulation of Migration Effects in Solder Bumps

Weide-Zaage, K.

Journal:

IEEE Transactions on Device and Materials Reliability

Year:

2008

Language:

english

File:

PDF, 1.73 MB

english, 2008

26

[IEEE 2010 17th IEEE International Symposium on the Physical and Failure Analysis of Integrated Circuits (IPFA 2010) - Singapore, Singapore (2010.07.5-2010.07.9)] 2010 17th IEEE International Symposium on the Physical and Failure Analysis of Integrated Circuits - Mechanical characterization of copper based metallizations with different via-bottom geometries

Ciptokusumo, Johar, Weide-Zaage, Kirsten, Aubel, Oliver

Year:

2010

Language:

english

File:

PDF, 729 KB

english, 2010

27

A design for robust wide metal tracks

M. Ackermann, V. Hein, C. Kovács, K. Weide-Zaage

Journal:

Microelectronics Reliability

Year:

2012

Language:

english

File:

PDF, 656 KB

english, 2012

28

Simulation of migration effects in nanoscaled copper metallizations

Weide-Zaage, Kirsten, Kashanchi, Farzan, Aubel, Oliver

Journal:

Microelectronics Reliability

Year:

2008

Language:

english

File:

PDF, 1.34 MB

english, 2008

29

Dynamic void formation in a DD-copper-structure with different metallization geometry

Kirsten Weide-Zaage, David Dalleau, Yves Danto, Helene Fremont

Journal:

Microelectronics Reliability

Year:

2007

Language:

english

File:

PDF, 1.72 MB

english, 2007

30

Moisture diffusion in Printed Circuit Boards: Measurements and Finite- Element- Simulations

Kirsten Weide-Zaage, Walter Horaud, Hélène Frémont

Journal:

Microelectronics Reliability

Year:

2005

Language:

english

File:

PDF, 596 KB

english, 2005

31

Qualification procedure for moisture in embedded capacitors

Frémont, Hélène, Kludt, Jörg, Wade, Massar, Weide-Zaage, Kirsten, Bord-Majek, Isabelle, Duchamp, Geneviève

Journal:

Microelectronics Reliability

Year:

2014

Language:

english

File:

PDF, 1.16 MB

english, 2014

32

[IEEE 7th. Int. Conf. on Thermal, Mechanical and Multiphysics Simulation and Experiments in Micro-Electronics and Micro-Systems - Como, Italy (24-26 April 2006)] 7th. Int. Conf. on Thermal, Mechanical and Multiphysics Simulation and Experiments in Micro-Electronics and Micro-Systems - Measurements and FE-Simulations of Moisture Distribution in FR4 based Printed Circuit Boards

Fremont, H., Horaud, W., Weide-Zaage, K.

Year:

2006

Language:

english

File:

PDF, 5.82 MB

english, 2006

33

Effects of salt spray test on lead-free solder alloy

Guédon-Gracia, A., Frémont, H., Plano, B., Delétage, J.-Y., Weide-Zaage, K.

Journal:

Microelectronics Reliability

Year:

2016

Language:

english

File:

PDF, 2.09 MB

english, 2016

34

[IEEE 2012 13th Intl. Conf. on Thermal, Mechanical & Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE) - Cascais, Portugal (2012.04.16-2012.04.18)] 2012 13th International Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems - Simulation-based prediction of reliability and robustness of interconnect systems for semiconductor applications

Ackermann, M., Hein, V., Weide-Zaage, K.

Year:

2012

Language:

english

File:

PDF, 1.59 MB

english, 2012

35

[IEEE 2014 IEEE International Reliability Physics Symposium (IRPS) - Waikoloa, HI, USA (2014.6.1-2014.6.5)] 2014 IEEE International Reliability Physics Symposium - Reliability performance of different layouts of wide metal tracks

Kludt, Jorg, Weide-Zaage, Kirsten, Ackermann, Markus, Kovacs, Christian, Hein, Verena

Year:

2014

Language:

english

File:

PDF, 801 KB

english, 2014

36

Dynamical IMC-growth calculation

Meinshausen, L., Weide-Zaage, K., Frémont, H.

Journal:

Microelectronics Reliability

Year:

2015

Language:

english

File:

PDF, 2.12 MB

english, 2015

37

[IEEE 2012 13th Intl. Conf. on Thermal, Mechanical & Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE) - Cascais, Portugal (2012.04.16-2012.04.18)] 2012 13th International Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems - Influence of the barrier properties on the mechanical stress and migration distribution in a copper metallization

Kludt, Jorg, Ciptokusumo, J., Weide-Zaage, K.

Year:

2012

Language:

english

File:

PDF, 938 KB

english, 2012

38

[IEEE 2016 Pan Pacific Microelectronics Symposium (Pan Pacific) - Big Island, HI, USA (2016.1.25-2016.1.28)] 2016 Pan Pacific Microelectronics Symposium (Pan Pacific) - Corrosion study on BGA assemblies

Guedon-Gracia, A., Fremont, H., Deletage, J.-Y., Weide-Zaage, K.

Year:

2016

Language:

english

File:

PDF, 2.04 MB

english, 2016

39

[IEEE 2004 IEEE International Reliability Physics Symposium. - Phoenix, AZ, USA (25-29 April 2004)] 2004 IEEE International Reliability Physics Symposium. Proceedings - Effect of thermal gradients on the electromigration life-time in power electronics

Nguyen, H.V., Salm, C., Krabbenborg, B., Weide-Zaage, K., Bisschop, J., Mouthaan, A.J., Kuper, F.G.

Year:

2004

Language:

english

File:

PDF, 164 KB

english, 2004

40

[IEEE 2018 Pan Pacific Microelectronics Symposium (Pan Pacific) - Big Island, HI, USA (2018.2.5-2018.2.8)] 2018 Pan Pacific Microelectronics Symposium (Pan Pacific) - Process, geometry and stack related reliability of thick ALCU-metal-tracks

Weide-Zaage, Kirsten, Hein, Verena

Year:

2018

Language:

english

File:

PDF, 680 KB

english, 2018

41

[IEEE Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE) - Bordeaux, France (2010.04.26-2010.04.28)] 2010 11th International Thermal, Mechanical & Multi-Physics Simulation, and Experiments in Microelectronics and Microsystems (EuroSimE) - Virtual prototyping of PoP interconnections regarding electrically activated mechanisms

Meinshausen, L., Weide-Zaage, K., Fremont, H., Feng, W.

Year:

2010

Language:

english

File:

PDF, 20.31 MB

english, 2010

42

[IEEE 2019 Pan Pacific Microelectronics Symposium (Pan Pacific) - Kauai, HI, USA (2019.2.11-2019.2.14)] 2019 Pan Pacific Microelectronics Symposium (Pan Pacific) - New-Automotive -Autonomous Driving Challenges For The Microelectronic Components

Weide-Zaage, Kirsten

Year:

2019

Language:

english

File:

PDF, 284 KB

english, 2019

43

[IEEE 2012 13th Intl. Conf. on Thermal, Mechanical & Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE) - Cascais, Portugal (2012.04.16-2012.04.18)] 2012 13th International Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems - Thermal management for stackable packages with stacked ICs

Meinshausen, L., Weide-Zaage, K., Fremont, H.

Year:

2012

Language:

english

File:

PDF, 1.68 MB

english, 2012

44

[IEEE 2013 14th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE) - Wroclaw (2013.4.14-2013.4.17)] 2013 14th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE) - Investigation of temperature gradients with regard to thermomigration in aluminium metallizations

Kludt, J., Weide-Zaage, K., Ackermann, M., Hein, V.

Year:

2013

Language:

english

File:

PDF, 1.60 MB

english, 2013

45

[IEEE 2016 17th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE) - Montpellier, France (2016.4.18-2016.4.20)] 2016 17th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE) - Thermal-electric-mechanical simulation of a multilevel metallization system

Liu, Yanpeng, Weide-Zaage, Kirsten

Year:

2016

Language:

english

File:

PDF, 1.19 MB

english, 2016

46

[IEEE 2015 16th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE) - Budapest, Hungary (2015.4.19-2015.4.22)] 2015 16th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems - GEANT4 simulations in terms of radiation hardness of commercially available SRAM

Moujbani, Aymen, Weide-Zaage, Kirsten, Romer, Berthold, Sabath, Frank

Year:

2015

Language:

english

File:

PDF, 1.20 MB

english, 2015

47

Condoms drive HIV decline in South Africa

Kludt, J., Weide-Zaage, K., Ackermann, M., Hein, V.

Journal:

Year:

2012

Language:

english

File:

PDF, 805 KB

english, 2012

48

[IEEE 2013 14th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE) - Wroclaw (2013.4.14-2013.4.17)] 2013 14th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE) - Characterization of a new designed octahedron slotted metal track by simulations

Kludt, J., Weide-Zaage, K., Ackermann, M., Hein, V.

Year:

2013

Language:

english

File:

PDF, 2.04 MB

english, 2013

49

[IEEE 2009 10th International Conferene on Thermal, Mechanical and Multi-Physics simulation and Experiments in Microelectronics and Microsystems (EuroSimE) - Delft, The Netherlands (2009.04.26-2009.04.29)] EuroSimE 2009 - 10th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems - Electrically driven matter transport effects in PoP interconnections

Feng, W., Weide-Zaage, K., Verdier, F., Plano, B., Guedon-Gracia, A., Fremont, H.

Year:

2009

Language:

english

File:

PDF, 826 KB

english, 2009

50

[IEEE Thermal and Mechanical Simulation and Experiments in Microelectronics and Microsystems - EuroSimE 2004 - Brussels, Belgium (10-12 May 2004)] 5th International Conference on Thermal and Mechanical Simulation and Experiments in Microelectronics and Microsystems, 2004. EuroSimE 2004. Proceedings of the - Void formation in a copper-via-structure depending on the stress free temperature and metallization geometry

Weide-Zaage, K., Dalleau, D., Danto, Y., Fremont, H.

Year:

2004

Language:

english

File:

PDF, 1.11 MB

english, 2004

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